Position Summary The Package Designer is responsible for product and tooling design. Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for thi…
Position Summary The Process Associate Engineer willbe responsible to support the organisation’s Product Development and NewProduct Introduction activities reliably and efficiently. Candida…
Position Summary The Package Designer is responsible for product and tooling design. Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for thi…
Position Summary The Electrical Simulation Engineer is responsible for product package electrical simulation. Candidates with semiconductor packaging experience are encouraged to apply for…
Position Summary The Associate Engineer, QA (Process Quality Control) is responsible for supporting the PQC team through accurate data entry, maintenance of quality records, and preparation…
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