Engineer - Test Process (WLCSP)

Responsibilities

• Support production operations across Taping, Backgrind (BG), Wafer Mounting, Laser Marking, Laser Grooving, and Dicing to ensure stable manufacturing output.
• Lead new device introductions by driving recipe qualifications, data collection, and recipe optimization.
• Troubleshoot process issues and manage machine setups to minimize downtime and reduce cycle times.
• Conduct risk assessments to proactively identify and mitigate potential manufacturing hazards and defects.
• Author and maintain critical engineering documentation, including SOPs, Work Instruction Procedures, and Out-of-Control Action Plans (OCAPs).
• Generate technical reports and preserve accurate engineering data for audit readiness.
• Collaborate with cross-functional teams to enforce strict SOP compliance and robust production line controls.
• Drive continuous improvement by executing CIPs focused on quality enhancement, yield optimization, and cost reduction.
• Enforce workplace standards, ensuring strict compliance with company policies, safety protocols, and 5S housekeeping.

Requirements

• Bachelor's Degree in Engineering or a related technical discipline.
• 3+ years of experience within a semiconductor manufacturing environment.
• Hands-on expertise operating Taping, Backgrind, Lasermark, Wafer Mount, Laser Groove, Dicing, and PSI machinery.
• Strong command of core quality tools, including 8D problem-solving, FMEA, Control Plans, and SPC.