FE CPIE Manager/Senior Manager

Position Overview

As a Senior Manager, FECOS cPIE PI PTO, you will lead a global organization responsible for strategic yield programs, technology ramp execution, qualification readiness, and cross-fab performance benchmarking. You will define and drive the One PTO operating model, establish network-wide yield management strategies, and influence executive-level decisions for advanced DRAM and HBM technologies.

This role requires strong technical depth in semiconductor process integration, proven leadership of global cross-functional teams, and the ability to transform complex data into actionable business decisions. You will be responsible for building organizational capability, accelerating technology learning cycles, standardizing operational excellence, and driving transformative solutions including automation and AI-enabled workflows.

Responsibilities

• Lead the global cPIE PTO organization to achieve yield, quality, qualification, and technology ramp objectives across multiple semiconductor technology nodes.

• Define and execute network-wide yield strategies including yield projection, yield wave management, homerun programs, LPI management, MPUP planning, and risk assessments.

• Establish and standardize PTO BKMs, SOPs, and business processes across all manufacturing sites to improve consistency, productivity, and cycle of learning.

• Drive One PTO alignment across PI, YE, RDA, TD, Manufacturing, and Quality organizations to ensure synchronized execution and rapid issue resolution.

• Provide executive-level visibility of business risks, yield projections, qualification readiness, and technology-ramp health through strategic reviews and steering committees.

• Build organizational capability by developing PTO talent pipelines, mentoring engineers and managers, and establishing technical competency frameworks.

• Drive digital transformation through automation, advanced analytics, artificial intelligence, and decision-support systems that accelerate yield learning and business outcomes.

• Influence technology roadmaps, network standards, and long-term process integration strategies to improve Micron's competitive advantage.

Requirements :

• Bachelor's, Master's, or PhD degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering, Semiconductor Engineering, or a related discipline.

• 7+ years of semiconductor industry experience in Process Integration, Yield Engineering, Technology Development, Manufacturing, or related technical leadership roles.

• Demonstrated experience driving yield improvement, qualification readiness, and technology ramp execution in advanced semiconductor manufacturing.

• Strong understanding of semiconductor process integration, yield management systems, defect mechanisms, process interactions, and device performance.

• Experience leading large cross-functional organizations and influencing decisions across multiple engineering and business functions.

• Strong analytical and data-driven problem-solving skills with application of model-based engineering methodologies.

• Excellent executive communication, organizational leadership, and stakeholder management capabilities.

• Experience serving as a PTO, program owner, or strategic technical leader for advanced DRAM, HBM, NAND, or emerging memory technologies.

• Track record of establishing organization-wide standards, BKMs, operating models, and business process transformations.

• Demonstrated success leading global programs involving multiple fabs, sites, and engineering organizations.

• Experience building and developing technical leaders, managers, and high-potential talent.

• Strong understanding of qualification methodologies, conversion management, yield projection systems, and manufacturing KPIs.

• Experience presenting business and technical strategies to executive leadership teams.

• Knowledge of AI, machine learning, automation systems, and digital transformation initiatives within semiconductor manufacturing.

• Ability to balance strategic vision with operational execution in a fast-paced technology environment.

• Strong collaboration skills with a proven ability to drive alignment across geographically distributed teams.

• Experience and/or passion for integrating Agentic AI capabilities into future engineering, yield, and manufacturing workflows.