Engineer , Pkg Reliability (Open)

Position Overview:
As a Global Quality (GQ) Package Reliability Engineer at Micron Technology Inc., you will be accountable for ensuring the quality and reliability of semiconductor packages across assigned product lines. This role encompasses end-to-end coordination of package qualification activities for new products, as well as for new designs, materials, or processes. You will provide recommendations on product release decisions based on comprehensive reliability test results.

Key Responsibilities:

• New Product Qualification :

• Lead and coordinate package qualification efforts for new products and process introductions.

• Develop and implement robust qualification plans for new technologies and product developments.

• Provide recommendation on new product release readiness based on reliability assessment outcomes.

• Reliability Test Planning and Execution:

• Develop and devise reliability test plans to evaluate risks associated with excursions, conversions, and qualification issues.

• Recommend effective screening methodologies for quality-sensitive lots.

• Maintain and improve monitoring systems to ensure ongoing package quality.

• Root Cause Analysis and Corrective Actions:

• Participate and drive in 8D problem-solving processes.

• Coordinate root cause investigations and corrective action plans for qualification failures and customer RMAs.

• Prepare and present technical reports for internal and external partners.

• Customer and Partner Engagement:

• Serve as a technical liaison for both internal teams and external customers regarding package-related to quality and reliability concerns.

• Evaluate customer requests for alignment with Micron’s quality policies.

• Provide technical expertise and support for customer inquiries and requirements.

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Skills:

• Good knowledge of semiconductor package assembly processes and surface mount technology.

• Good understanding of thermo-mechanical, mechanical and material interactions affecting reliability in IC components and PCB assemblies.

• Proficiency in industry-standard reliability test methods, life prediction acceleration models, and statistical sampling.

• Good analytical problem-solving abilities and project management skills.

• Good written and verbal communication skills in English and digital literacy are vital.

• Familiarity with backend manufacturing software systems.

• Understanding of quality management and statistical tools (e.g., SPC, FMEA, 8D CAR).

• Self-motivated, meticulous, and capable of independent work and multi-cross functional team

Qualifications and Experience Required

• Bachelor’s or Master’s in Engineering (Mechanical, Electronics, Materials Science)

• Candidates with 0-1 year experience in Micro Electronic Packaging, Quality/Reliability Engineering/testing, or Failure Analysis