Senior Advanced Packaging Application Engineer

Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB)

Responsibilities:

Customer Application Engineering

• Understand customer packaging roadmaps and manufacturing requirements.

• Translate process requirements into equipment specifications.

• Participate in customer technical discussions and application reviews.

• Support technical sales activities and customer demonstrations.

• Gather customer feedback and recommend future product enhancements.

Advanced Packaging Process Development

1. Develop and support applications involving:

• Thermo Compression Bonding (TCB)

• Flip Chip Assembly

• Hybrid Bonding

• HBM Packaging

• CoWoS

• CoPoS

• 2.5D Packaging

• 3D Packaging

• Chiplet Integration

• Large Die Packaging

1. Evaluate and optimize:

• Bond force

• Temperature profiles

• Process windows

• Alignment accuracy

• Package warpage

• Yield

• Reliability

Equipment Development

1. Work closely with multidisciplinary engineering teams to define:

• Machine architecture

• Functional specifications

• Accuracy requirements

• Throughput targets

• Thermal performance

• Bonding process capability

• Reliability requirements

• Customer acceptance criteria

- Provide technical guidance throughout equipment development.

Machine Qualification

1. Serve as the internal customer during equipment development.

2. Responsibilities include:

• Defining machine acceptance criteria

• Process qualification

• FAT and SAT support

• Customer buyoff support

• Qualification reporting

• Continuous performance improvement

Technology & Market Intelligence

1. Monitor industry developments in:

• Advanced packaging technologies

• Semiconductor manufacturing trends

• Customer requirements

• Competitor equipment

• Emerging packaging architectures

1. Support future product strategy and technology roadmap planning.

Requirements:

1. Bachelor's or Master's Degree in:

• Materials Engineering

• Mechanical Engineering

• Electrical Engineering

• Chemical Engineering

• Physics

• Semiconductor Engineering

• Related Engineering disciplines

1. Minimum 5 years experience in semiconductor advanced packaging.

2. Hands-on experience in one or more of the following:

• Thermo Compression Bonding (TCB)

• Advanced Packaging Process Development

• Flip Chip Assembly

• New Product Introduction (NPI)

• Process Qualification

• Equipment Qualification

• Manufacturing Engineering

• Customer Process Development

1. Experience supporting advanced package technologies such as:

• HBM

• CoWoS

• CoPoS

• Chiplets

• 2.5D Packaging

• 3D Packaging

• Large Die Packaging

1. Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.

2. Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.

3. Strong understanding of:

• Thermo Compression Bonding (TCB)

• Semiconductor Packaging

• Flip Chip Assembly

• Process Qualification

• SPC

• DOE

• Yield Improvement

• Reliability Testing

• Failure Analysis

• Package Warpage

• Thermal Management

• Alignment Accuracy

• Semiconductor Manufacturing Processes

Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.