Semicon Wafer Bumping Equipment Senior/ Engineer

Job Summary:

Responsible for maintaining, troubleshooting, and optimizing wafer bumping equipment toensure high equipment uptime, stable production, and good yield.

Key Responsibilities:

Install,qualify, maintain, and troubleshoot wafer bumping equipment.

Support equipment such as plating, PVD/sputtering, lithography, cleaning, stripping,and reflow systems.

Perform preventive/corrective maintenance and root-cause analysis.

Improveequipment uptime, OEE, MTBF, and MTTR.

Supportnew equipment installation, upgrades, and production ramp-up.

Work with process engineers and vendors to resolve equipment/process issues.

Maintain equipment documentation and safety standards.

Requirements:

Degree in Engineering or related field.

2–5years of equipment such as plating, PVD/sputtering, lithography, cleaning,stripping, and reflow systems equipmentengineering experience preferred.

Experience in wafer bumping or semiconductor backend/advanced packaging is an advantage.

Strong mechanical/electrical troubleshooting and problem-solving skills.

Good communication and teamwork skills.

All Successful candidates can expect a very competitive remuneration package and acomprehensive range of benefits.

Please email your resume in a detailed MS Word format to [email protected] stating

1)Current Drawn

2)Expecting Salary

3)Date Available

4)Reason to Leave each job:

Weregret that only shortlisted candidates will be notified

JoyceKoh Ai Leng

PeopleProfilers Pte Ltd

20Cecil St, #08-09, PLUS Building, Singapore 049705

Tel:6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID: JOB-01077