Semicon Equipment Engineer (Pre Assembly)

Responsibilities:

Operate,maintain, troubleshoot, and optimize die attach, wafer saw, backgrinding,Laser groove ,tape mount, or die sorting equipment

Performpreventive and corrective maintenance to ensure equipment uptime andreliability.

Supportequipment installation, qualification, ramp-up, and process improvement.

Troubleshootmechanical, electrical, pneumatic, vacuum, and automation issues.

Analyzeequipment failures and implement corrective actions.

Workwith Process, Production, Quality, and vendors to resolve equipment issues.

Maintainequipment documentation, SOPs, and maintenance records.

Requirements:

Diploma/Degreein Mechanical, Electrical, Electronics, Mechatronics, or related field.

Experiencein semiconductor manufacturing/equipment engineering preferred

Equipmentexperience in die attach, wafer saw,backgrinding, Laser groove ,tape mount, or die sorting equipment

Goodtroubleshooting, analytical, and problem-solving skills.

Willingto work in a cleanroom and shift environment.

AllSuccessful candidates can expect a very competitive remuneration package and acomprehensive range of benefits.

Pleaseemail your resume in a detailed MS Word format to [email protected]

1)Current Drawn

2)Expecting Salary

3)Date Available

4)Reason to Leave each job:

Weregret that only shortlisted candidates will be notified

JoyceKoh Ai Leng

PeopleProfilers Pte Ltd

20Cecil St, #08-09, PLUS Building, Singapore 049705

Tel:6950 9737

www.peopleprofilers.com

EALicense Number: 02C4944

EAPersonnel Reg nos : R1110618

JobID:JOB-01078