Senior Engineer

Job responsibilities

• Assembly and packaging process improvement and optimization in systematic manner
• Documentation for key assembly and packaging processes, and implementation of effective process control practices to achieve repeatability of quality assembly process
• Propose, evaluate and refine current process steps for yield and capacity improvements
• Documentation and implementation of preventive and corrective action, and best-known methods to allow more efficient process troubleshooting
• Qualification of new assembly and packaging related direct materials
• Buyoff and release of new assembly and packaging equipment
• Analyze process out of control and failures, and develop corrective actions accordingly
• Monitor process performance and suggest improvements
• Work with specialists/vendors to design and develop new process
• Ensure compliance with ISO standards and support audit functions
• Provide support for customer returns
• Perform process qualification before handing off to production
• Develop cost-reduction initiatives while still maintaining quality and productivity
• Aligning and supporting packaging roadmaps, developing and optimizing processes to improve product quality and reliability
• Working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems

Requirements

• Degree in Mechanical Engineering / Material Science
• Minimum 5 years’ working experience in semiconductor assembly and packaging process
• Ideally with strong semiconductor assembly and packaging process experience and knowledge, deep understanding about processes such as wafer cleaving, die attachment (especially eutectic die attach), wire bonding, etc.
• Strong skills in developing and refining process to enhance yield, reliability and efficiency, with vast hands-on experience in DOE (design of experiment) practice
• Strong analytical skills to identify and resolve process issues effectively
• Ability to develop long-term strategies for process improvement and innovation
• Familiarity with industry standards and regulations related to semiconductor assembly and quality control
• Ability to lead projects and work collaboratively with cross-functional teams
• Able to mentor junior engineers and lead team in process improvement initiatives