Senior Process Engineer - Wet Etch, Clean & Stripping

Responsibilities

• Process Management: Develop, qualify, and maintain wet etch, clean, and stripping processes for semiconductor wafer fabrication and advanced packaging.

• Optimization & SPC: Optimize process parameters to achieve target specifications for critical dimensions, surface cleanliness, and defect performance. Monitor process health using Statistical Process Control (SPC) and implement corrective actions for deviations.

• Defect & Yield Analysis: Investigate yield excursions, defects, and process abnormalities using root cause analysis methodologies.

• Experimental Design: Design and execute Design of Experiments (DOE) to enhance process performance, boost yield, and lower manufacturing costs.

• Cross-Functional Collaboration: Partner with Equipment, Production, Quality, Product Engineering, and R&D teams to resolve technical issues and support production goals.

• NPI & Transfer: Support New Product Introductions (NPI), process transfers, and technology development activities.

• Materials & Equipment Evaluation: Evaluate and qualify new chemicals, materials, and process technologies.

• Documentation & Compliance: Prepare and maintain specifications, work instructions, FMEA, control plans, and qualification reports. Ensure compliance with EHS standards, chemical management procedures, and waste disposal regulations.

• Continuous Improvement: Drive initiatives focused on yield enhancement, defect reduction, cycle-time improvement, and cost savings.

Requirements

• Education: Bachelor’s degree or higher in Chemical Engineering, Materials Science, Chemistry, Semiconductor Engineering, or a related discipline.

• Experience: Minimum 2 years of semiconductor manufacturing experience, preferably in wet etch, cleaning, stripping, plating, or wafer-level packaging processes.

• Technical Knowledge: Strong understanding of semiconductor process integration, wet chemical processing, chemical compatibility, contamination control, and surface preparation techniques.

• Tools & Methodologies: Hands-on experience with DOE, SPC, FMEA, CAPA, and statistical analysis tools such as JMP or Minitab.

• Equipment Familiarity: Knowledge of wet process equipment, automated wet benches, and chemical delivery systems.

• Soft Skills: Strong analytical, troubleshooting, and problem-solving capabilities.
  
  We regret that only shortlisted candidates will be notified.

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