PROCESS ENGINEER (WIREBOND)

Job Description:

• Develop new and improve existing gold, silver, and copper wire bonding process capability, stability, and quality
• Ensure wire bonding process meets customer’s specifications and requirements
• Conduct failure analysis to identity root cause of wire bonding failures and find solutions to prevent future failure
• Co-ordinate NPI and NPQ activities to meet given timeline
• Qualify new product, material, device, and machinery
• Participate in new tape development, and new material development activities
• Perform supplier sourcing and qualification activities jointly with purchasing and engineering team
• Benchmark new materials and new equipment technology in the market
• Train co-workers on new process implementation and new machinery operations
• Maintain, troubleshoot, and perform minor repair of assembly and test machinery
• Develop new and update existing Standard Operating Procedures
• Participate in internal audits, customers’ audits and external audits
• Comply with all quality, environmental, health, safety, and security policies and procedures of the Company

Job Requirements:

• Degree or Diploma in Engineering (preferably in electronic or material Science)
• Minimum 3 years working experience in a manufacturing environment (preferably in Semi-con assembly and test environment)
• Must have working knowledge and experience in the material science of bonding wires (gold, silver, copper), encapsulant epoxy, and structural substrates.
• Experience in operating ESEC, ASM, KNS wire bonders using Gold, Silver, and Copper wires
• Experience in IC assembly processes such as die attach, wire bond, encapsulation, and testing
• Experience in maintenance of die attach, wire bond, encapsulation, and testing machinery
• Able to multi-tasks and work in a fast-paced environment,
• Good team player, able to work independently, resourceful, willing to learn new skills, and has initiatives
• Knowledge in FMEA, SPC, OCAP, DOE, ISO9001:2000, ISO14001:2004, QEMS, CQM, JEDEC
• Good in problem solving, excellent interpersonal and communication skill