Etch Process Engineer

Applied Angstrom Technology Pte. Ltd. (“AAT”) is a start-up semiconductor equipment company with our headquarter in Singapore. AAT has the mission to be the world-class process technology provider in the Angstrom era for 3D device manufacturing and to build an ecosystem in equipment design, manufacturing, and component/material supply chain in US and Singapore.

As a Process Engineer at AAT, you will operate on cutting-edge technology, harnessing atomic precision, material science, and surface engineering to push technical boundaries. Your role involves developing new and advanced process formulations, defining equipment hardware to meet processing requirements, evaluating test data, and coordinating design requirements to ensure compatibility of processing methods. Your expertise and knowledge play a crucial role in our customers success, making an impact on the next generation of semiconductor breakthroughs.

Job Description:

The ideal candidate shall be able to perform the following:

• Conduct process engineering research, development, and evaluation in support of AAT’s cutting-edge semiconductor equipment and systems.

• Review and enhance processing techniques and methods applied in the manufacture and fabrication of products.

• Develop and sustain new processes and process improvements to reduce production costs and increase yields.

• Compile and analyze test data to establish next steps in process development and determine appropriate limits and variables for process specifications.

• Collaborate internally to plan, collect data, analyze results, and report on customer demos for existing process applications.

• Partner cross-functionally and with customers to understand roadmaps, process flow, inflection points, requirements, and business challenges.

• Contribute to next generation product development and release activities supporting the semiconductor roadmap.

• Provide leadership, clear direction, and guidance to process technicians to support execution activities.

Job Qualifications:

• Bachelor’s or Master’s degree in Materials Science, Chemical Engineering, Chemistry, Physics, or a related engineering discipline.

• 3+ years of hands-on experience in semiconductor equipment development or semiconductor fab process engineering (R&D or pilot line preferred).

• Strong laboratory and tool operation skills, including experience with wafer surface preparation, thin-film processes, and analytical/characterization techniques.

• Proficient in Statistical Process Control (SPC), Design of Experiments (DOE), and structured process optimization methodologies.

• Competent with statistical analysis tools such as JMP, Minitab, or equivalent for data modeling, correlation, and root-cause analysis.

• Solid understanding of plasma science, including RIE, ICP/CCP systems, Atomic Layer Etching (ALE), and plasma-surface interaction fundamentals.

• Knowledge in materials synthesis and characterization (e.g., XPS, AFM, SEM, ellipsometry, profilometry).

• Experience developing or optimizing semiconductor processes, such as dielectric/metal etch, thin-film deposition, surface modification, or nanoscale patterning.