Technology Development Engineer (Advanced Packaging)
About this job
We are looking for a skilled OSAT & AdvancedPackaging Engineer to drive Advanced packaging with external OSAT partners.This role will focus on advanced packaging technologies, ensuring high-quality,cost-effective, and timely product delivery while collaborating withcross-functional team.
Job Responsibilities:
- Work on 2.5D/3D packaging platform technologies.
- Develop bump, underfill, molding and RDL processes.
- Collaborate with internal R&D and OSAT partners to driveHeterogeneous Integration.
- New advanced packaging process verification and qualification.
- Customer engagement and new product verification
Capability
- Knowledge of bumping, molding, dicing, bonding, RDL (RedistributionLayer), and interconnect technologies are plus.
- Experienced in 2.5D and 3DIC process development are plus.
- Skill on FMEA, control plan, DOE (design of experiment) and problemsolving.
- Good communication, self-motived and avid learner
Qualification
- Atleast bachelor degree in electronics/electrical/physics/Materials engineeringor other relevant fields.
- At least 2 years working experience inOSAT R&D/Packaging/Process engineer or other relevant fields.
- ProficientEnglish oral and writing skill.
Market insight
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Frequently asked questions
What salary can I expect?
The employer lists 4 500 – 7 000 $ for this role at UNITED MICROELECTRONICS CORPORATION (SINGAPORE BRANCH) in Tampines. For comparison, the local market median is about 5 540 $ based on 761 similar offers.
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