Senior / Product Engineer - (NAND firmware integration)

Experience Level: Engineer / Senior Engineer / Principal Engineer (E1–E5)

As an NFI Engineer at Micron, you will support the debug and root cause analysis of NAND-related issues across a wide range of end products, including SSDs, UFS and other NAND-based storage solutions. Working closely with Product Development, System Engineering, Firmware, Quality, and Failure Analysis teams, you will investigate complex issues involving NAND devices, firmware interactions, media management, controller interfaces, and system behavior.

You will analyze system logs, characterization data, protocol traces, electrical measurements, and failure analysis results to identify root causes and drive corrective actions. The role involves supporting product qualification and sustaining activities, identifying NAND design marginalities and defectivity-related issues, improving product robustness, and developing automation or AI-assisted workflows to improve debug efficiency and accelerate issue resolution.

In addition, you will leverage AI-assisted tools, data analytics, and automation solutions to accelerate debug activities, improve root cause turnaround time, and enhance engineering productivity. Engineers are encouraged to explore innovative approaches using AI technologies to streamline data analysis, automate repetitive tasks, and improve decision-making in complex debug investigations.

Engineers will contribute according to their experience level, from learning NAND technologies and debug methodologies to leading complex technical investigations, driving technical strategy, mentoring engineers, and influencing solutions across multiple products and technology generations.

Key Responsibilities

• Own and drive NAND Failure Investigation (NFI) activities for product qualification and sustaining support.

• Debug and perform root cause analysis of NAND-related system failures, including NAND device, firmware interactions, controller interfaces, signal integrity, and media management issues.

• Analyze characterization data, system logs, protocol traces, tester data, and silicon measurements to identify failure mechanisms.

• Collaborate with Product Development Teams (PDT), System Engineering, Firmware, Quality, and Manufacturing teams to resolve qualification and customer-reported issues.

• Drive containment, corrective actions, and long-term solutions for critical product issues.

• Support NAND technology qualification, new product introduction (NPI), and volume manufacturing readiness.

• Identify design marginalities, defectivity-related issues, and reliability concerns impacting product performance and yield.

• Develop debug methodologies, automation tools, and AI-assisted workflows to improve RCA efficiency and reduce turnaround time.

• Drive continuous improvement initiatives by capturing learnings into knowledge databases and standardized debug procedures.

• Present technical findings and recommendations to management and cross-functional stakeholders.

Requirements

Minimum Qualifications

• Bachelor's, Master's, or PhD in Electrical & Electronics Engineering, Computer Engineering, Computer Science, Semiconductor Engineering, or related disciplines

• Strong analytical, troubleshooting, and problem-solving skills

• Excellent verbal and written communication skills

• Self-motivated with a strong learning mindset

• Ability to collaborate effectively across global cross-functional teams

Preferred Qualifications

• Knowledge of NAND Flash memory operation and architecture

• Familiarity with SSD, UFS, eMMC, or other storage systems

• Experience with system debug, root cause analysis, validation, or product qualification

• Programming or scripting experience (Python, SQL, data analytics tools)

• Experience with automation, AI-assisted engineering workflows, or semiconductor product development