Reliability Engineer

THE ROLE:

Join AMD’s global package reliability team and support package- and board-level reliability activities for integrated circuit and graphics card products using advanced flip-chip and chiplet package technologies. Based in the Singapore Package Reliability Lab, this fresh graduate role provides hands-on exposure to component- and board-level reliability stress testing for AMD’s leading-edge packages.

THE PERSON:

The ideal candidate is a motivated, collaborative, and proactive fresh graduate engineer with good organizational and project coordination skills. Strong verbal and written communication skills will support effective collaboration with global teams. The candidate should be eager to learn, contribute to team success, and develop technical expertise in package reliability.

KEY RESPONSIBILITIES:

• Execute package qualification, reliability assessment, and engineering evaluation activities.

• Coordinate package qualification activities for new products, designs, materials, or processes, including related logistics.

• Perform electrical, mechanical, visual, and acoustic microscopy assessments and analyze the results.

• Validate reliability test failures and support detailed debugging and root-cause identification.

• Develop open/short-circuit test programs to support chip-package interaction testing.

• Responsible for quality and timeliness of results for assigned tasks.

PREFERRED EXPERIENCE:

• Knowledge of statistical analysis.

• Familiarity with programming or scripting languages such as C, C++, Java, Ruby, Perl, or Python.

• Familiarity with Windows, Unix, and Linux operating systems.

• Relevant academic projects, laboratory work, internships, or research exposure are beneficial.

ACADEMIC CREDENTIALS:

• A bachelor’s or master’s degree in electrical engineering, electronic engineering, mechanical engineering, materials science and engineering, or a related technical discipline is preferred.