General Manager, After-Sales Product Management

Responsibilities

1. Take overall responsibility for the operations and strategic planning of the after-sales product management team for chip products, establishing a robust after-sales support system and processes to safeguard customer satisfaction and the products’ market reputation.
2. Oversee after-sales technical support, failure analysis and RMA (returns and replacements) management, coordinating R&D, testing and production teams to respond swiftly to customer feedback and see issues through to closure.
3. Manage the life cycle of after-sales products, including tracing batch issues, driving yield improvement, planning EOL (end of life) and developing customer migration plans.
4. Gather and analyse customer requirements and market feedback to inform product iteration and new product planning, continually strengthening product competitiveness.
5. Build and maintain key account relationships, participate in technical support and commercial negotiations for major customers, and drive industry ecosystem partnerships and brand building.

Requirements

1. Master’s degree or above in microelectronics, semiconductors, electronic information or a related field; PhD preferred.
2. At least 2 years’ experience in the semiconductor industry; experience in chip design, product management or customer support preferred.
3. Familiarity with the full chip product life cycle, from design and tape-out through mass production to after-sales, with an understanding of yield, reliability and quality management systems.
4. Excellent team management and cross-functional coordination skills, with the ability to lead a team to achieve goals in a high-pressure environment.
5. Strong commercial acumen and a customer-oriented mindset, with the ability to drive problem-solving from both technical and commercial perspectives.
6. Fluency in English as a working language; cross-cultural or overseas work experience preferred.