R&D Process Engineer (Die-to-Wafer)

• Support Flipchip and Underfill process development and qualification for advanced packaging applications.
• Contribute to improvements in process yield, quality, process capability, and manufacturing robustness.
• Support customer programs, NPI and technology transfer.
• Develop, optimize, and qualify Die-to-Wafer (D2W) processes, including Flipchip and Underfill, for advanced semiconductor packaging applications.
• Support process readiness, yield improvement, process robustness, and customer-specific technical solutions from development through NPI.
• Establish and maintain R&D process flows, recipes, instructions, and device information in MES to support engineering and qualification builds.

Requirements

• Bachelor’s degree in Engineering (Mechanical, Materials, Electronics, or related disciplines).
• 3–5 years of hands-on semiconductor process engineering experience preferred.
• Experience in Die-to-Wafer, Flip Chip, Underfill, die attach, or advanced packaging processes is an advantage.
• Strong problem-solving and analytical skills.
• Good communication skills with the ability to work effectively with cross-functional teams.
• Ability to work independently and manage multiple engineering activities in a fast-paced semiconductor environment.

JOB ID: JOB-JK30102006A

All Successful candidates can expect avery competitive remuneration package and a comprehensive range of benefits.

Kindly email your resume in adetailed Word format to [email protected]

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We regret that only shortlisted candidates will be notified

People Profilers Pte Ltd

• 20 Cecil Street, #08-09, Plus Building, Singapore 049705
• Tel: 69509745
• EA Licence Number: 02C4944
• EA Registration Number: R1108448
• EA Personnel: Tan Lili Gesse