Process Development Engineer (Wire Bond)

Responsibilities:

• Ensure processes meet customer specifications and conduct failure analysis to identify root causes and implement corrective actions.
• Develop and optimize gold, silver and copper wire bonding processes to improve quality, stability and performance.
• Coordinate NPI, NPQ and qualification activities for new products, materials, devices and equipment.
• Support new tape and material development, supplier qualification and technology benchmarking.
• Maintain, troubleshoot and perform minor repairs on assembly and testing equipment.
• Develop and update SOPs, train colleagues on new processes and equipment, and participate in internal and external audits.
• Ensure compliance with company quality, environmental, health and safety requirements.

Requirements:

• Diploma or Degree in Electronics Engineering or Materials Science.
• Minimum 3 years of manufacturing experience, preferably in semiconductor assembly and testing.
• Familiarity with FMEA, SPC, OCAP, DOE, ISO 9001, ISO 14001, QEMS, CQM and JEDEC standards.
• Strong analytical, problem-solving and communication skills, with the ability to multitask and work independently in a fast-paced environment.
• Knowledge of bonding wire materials, encapsulants, substrates and IC assembly processes, including die attach, wire bonding, encapsulation and testing.
• Experience in maintaining assembly and testing equipment.

Interested candidates who wish to apply for the advertised position, please click on the APPLY button below.

EA License No: 13C6305

Reg. No.: R1985234 (GOH HOOI MING)

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