Senior Associate Process Engineer - Package pick & place process

About us

STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.

About the role

To provide technical and administrative support to Process Engineers in eWLB Backend2 Dept to ensure total customer satisfaction related to product quality, productivity and cost effectiveness.

Key responsibilities

• Perform production line sustaining to ensure all the processes are running without any quality issue

• Follow up the process improvement projects which assigned by Process Engineer

• Characterize new devices and create recipes in the machine.

• Immediate response to investigate and analyze products with problem

• Cross support with line supervisor to clear real time bottleneck that impact cycle time and quality

• Cross support with other Associate Engineer to clear equipment downtime

• Communicate with Engineers and external vendors to resolve problems and provide advanced training to less experienced Technical Specialists or Manufacturing Specialists

What we're looking for

• Diploma or Degree in Electric & Electronic, Mechanical & Mechatronics, Physics Engineering or equivalent

• 2 years of relevant experience in Die Pick & Place, Package Pick & Place or Tape & Reel are preferred

• Positive mindset with ability to adapt to fast-paced working environment

• Ability to work on 12 hours rotating shift