Senior / Equipment Engineer ( Semiconductor )

About the Role

Lead and support equipment engineering activities to sustain manufacturing operations, optimize equipment performance, improve Overall Equipment Effectiveness (OEE), resolve production and quality issues, and drive continuous improvements in yield, productivity, and cost efficiency.

Key Responsibilities

• Train and mentor Assistant Engineers (AEs) on equipment setup, conversion, troubleshooting, repair, and maintenance activities to support production demands.
• Develop and maintain spare parts inventory strategies to minimize equipment downtime and ensure operational continuity.
• Monitor and analyze OEE, machine utilization, and Fault Detection & Classification (FDC) data to identify opportunities for equipment improvement.
• Investigate equipment-related issues and implement innovative solutions to enhance reliability and performance.
• Liaise with equipment suppliers and external vendors to resolve technical issues and drive equipment enhancement initiatives.
• Identify yield, quality, and productivity improvement opportunities, and implement corrective and preventive actions to reduce manufacturing costs.
• Take ownership of backend assembly processes, including ball drop, reflow, taping/detaping, wafer mounting, saw singulation, open/short testing, and wafer probing operations.
• Support continuous improvement projects to enhance manufacturing efficiency and product quality.

Requirements

• Diploma in Mechanical Engineering, Mechatronics, Manufacturing Engineering, or a related discipline.
• Minimum 3 to 5 years of hands-on experience in semiconductor backend assembly or wafer bumping operations.
• Strong knowledge of backend assembly processes, equipment troubleshooting, and process optimization.
• Experience in yield improvement, OEE enhancement, and production support within a manufacturing environment.
• Ability to work independently and collaborate effectively with cross-functional teams and external vendors.
• Knowledge of reflow, wafer mount, saw singulation, probing, taping/detaping, and related semiconductor assembly equipment will be advantageous.

Interested candidates who wish to apply for the advertised position, please click APPLY NOW or email an updated copy of your resume/cv.

We regret that only shortlisted candidate will be notified.

Email Address: [email protected]

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EA License No: 19C9682

EA PersonnelNo: R1332294

EA Personnel Name: Ng Yih Hau ( Jonathan )