Signal Integrity & Power Integrity (SI/PI) Engineer

Company Overview

Broadcom Inc. is a global technology leader designing and supplying semiconductor and infrastructure software solutions for data centers, networking, software, broadband, wireless, storage, and industrial markets. Learn more at www.broadcom.com.

Job Summary

We are seeking an experienced Signal Integrity & Power Integrity (SI/PI) Engineer to optimize electrical designs, perform modeling, and validate high-speed IC packages and PCBs, collaborating with cross-functional teams to ensure robust system-level performance.

Responsibilities

• Perform 3D and 2.5D electromagnetic extractions on complex IC package and PCB interconnects using tools such as Ansys HFSS, Q3D, SIwave, or Cadence Sigrity to support design optimization.
• Execute pre-layout and post-layout signal integrity simulations for high-speed parallel interfaces (e.g., DDRx/LPDDRx) and multi-gigabit SerDes channels (PAM4/NRZ) to analyze impedance and transient behavior in Power Delivery Networks.
• Collaborate with IC package design teams and SoC architects to define and optimize bump/ball patterns, pin assignments, layer stack-ups, and routing strategies to meet strict SI/PI performance budgets.
• Partner with substrate and OSAT suppliers through the packaging team to evaluate and integrate advanced packaging technologies including 2.5D/3D integration, silicon interposers, and high-density build-up substrates.
• Plan and conduct high-frequency laboratory measurements in time and frequency domains on bare substrates, silicon test chips, and system PCBs using VNAs, TDRs, high-bandwidth oscilloscopes, and micro-probe stations to validate designs.
• Develop, document, and standardize automated simulation workflows, electromagnetic extraction best practices, and package/PCB design guidelines to improve design efficiency and consistency.

Required competencies and certifications

• Ph.D. in Electrical Engineering or related field with 3+ years of industry experience; OR
• Master’s degree in Electrical Engineering with 6+ years of experience; OR
• Bachelor’s degree in Electrical Engineering with 8+ years of experience.
• Strong knowledge of electromagnetic field theory, transmission line theory, microwave engineering, S-parameters, and circuit analysis.
• Advanced proficiency in electromagnetic and circuit simulation software including Ansys HFSS, Q3D, SIwave, Designer; Keysight ADS; Synopsys HSPICE; and Cadence Sigrity (PowerSI, Clarity, or OptimizePI).
• Proven hands-on experience operating Vector Network Analyzers (VNA), Time-Domain Reflectometry (TDR), high-bandwidth oscilloscopes, and micro-probing setups for S-parameter de-embedding and transient correlation.
• Working familiarity with package layout and physical design tools such as Cadence Allegro Package Designer (APD) and AutoCAD.
• Strong analytical skills, meticulous documentation practices, and effective cross-functional communication abilities.

Preferred competencies and qualifications

• Experience with high-speed serial standards such as PCIe Gen 5/6 or 112G/224G SerDes and high-bandwidth memory technologies like HBM2e/HBM3, DDR5/LPDDR5.
• Experience with 2.5D/3D IC architectures including chiplets, interposers, and bridge technologies.