Principal Engineer — Printhead and Print Process Lead

About us

We are an early-stage, venture-backed Singapore deep-tech company building manufacturing technology for photonic interconnects in AI computing. We are assembling a small, senior team to turn a proven laboratory process intoa qualified, manufacturable product, working in lab and cleanroom facilities in Singapore.

The role

You will own our printing process end to end: print-tool design, print recipes, yield learning and the qualification of a manufacturable process. You lead a team of three engineers and scientists and are the technical owner of the programme's milestones.

What you will do

• Define requirements and interface specifications for the print tooling and target devices: geometry, placement accuracy, cycle timeand yield targets.

• Design print-tool (stamp) architectures and develop micro-transfer printing recipes for ultra-thin, fragile, millimetre-scale device coupons.

• Run designed experiments and build the yield-learning loop from print data, failure analysis and simulation.

• Qualify the process for reproducibility, tool lifetime and throughput; own the control plan, design rules and process documentation.

• Manage foundry, characterisation and equipment partners.

• Lead invention disclosures and support patent filings.

• Lead and mentor the fabrication, materials and metrology team.

What you will bring

• PhD or MSc in mechanical engineering, materials science or electrical engineering.

• 5+ years in semiconductor process development, soft lithography or micro-transfer printing.

• A record of taking a process from lab demonstration to a documented, repeatable production process.

• Hands-on DOE, SPC and failure analysis (optical inspection, SEM).

Nice to have

• Micro-transfer printing, wafer bonding or die-attach experience in advanced packaging.

• Silicon photonics or thin-film optical devices.

• Finite-element modelling of contact mechanics and adhesion.

• Qualifying a process or consumable with a customer,foundry or OSAT.

What success looks like

By 12 months, a print process meeting yield and placement targets on functional devices at target speed; by 24 months, a qualified, documented manufacturing process and a delivered pilot lot.