Senior Scientist, Advanced Wafer-to-wafer Hybrid Bonding, APM, IME

Key Responsibilities

• Develop and optimize wafer-to-wafer hybrid bonding processes for advanced semiconductor packaging.
• Design and execute DOE to improve process capability, yield, and reliability.
• Develop surface preparation, cleaning, plasma activation, bonding, and post-bond annealing processes.Investigate bonding defects, including voids, contamination, misalignment, and interface failures, through systematic root-cause analysis.
• Collaborate with design, integration, FAB, equipment, and reliability teams to develop robust bonding solutions.
• Evaluate and qualify new bonding equipment, materials, and emerging technologies.
• Perform wafer characterization using advanced metrology and failure analysis techniques.
• Analyse process data, establish process control methods, and document technical results.
• Contribute to technology innovation through patents, publications, and collaboration with internal and external partners.
  
  

Qualifications

• Ph.D. in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Chemistry or a related discipline. At least 5 years of relevant experience.
• Hands-on experience in semiconductor process development within a cleanroom environment.
• Experience in hybrid bonding, wafer bonding, advanced packaging, semiconductor assembly, or related process modules is preferred.
• Strong analytical and problem-solving skills with experience in DOE and statistical data analysis.
• Self-motivated team player with excellent communication skills and a passion for developing innovative semiconductor technologies.

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The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.