Senior / Equipment Engineer

About us

STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.

About the role

Manage AEs, sustain equipment performance, improve OEE, resolve line/quality issues, and drive yield, productivity and cost improvements.

Key responsibilities

• Plan training program on new incoming line sustaining AE on the job function on set-up, conversion and equipment repair to support production loading.

• Plan and develop machine parts stock available to minimize downtime on awaiting for parts delivery.

• Review the OEE, machine utilization and FDC regularly to seek improvement on equipment.

• Develop creative and innovative solutions to problems with considerable initiatives and independent thoughts.

• Communicate with external vendors to resolve problems as line encounter and work on improvement.

• Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost.

• In-charge of ball drop, reflow, taping, detaping, wafer mounter, saw singulation process and open short and wafer probing testing.

• Experience in backend assembly process is preferred.

What we're looking for

• Diploma in Mechanical Engineering or equivalent.

• Minimum with 3 – 5 years of relevant experience in wafer bumping for backend operations.