Engineer, NPI

Position Summary

The NPI Engineer will be responsible for supporting new product introduction (NPI) activities and ensuring smooth transition from development to high-volume manufacturing. This role will work closely with cross-functional teams to establish, qualify, and optimize manufacturing processes across semiconductor operations including lithography, wet processes, die preparation, pick-and-place (PnP), reconstitution (recon), molding, and other backend processes.

Responsibilities

New Product Introduction (NPI)

• Lead and support NPI builds from prototype through engineering and qualification stages to mass production.

• Drive process setup, line readiness, and material qualification for new products.

• Collaborate with R&D, Product Engineering, and Quality teams to ensure manufacturability and process robustness.

• Develop and review process flow, work instructions, FMEA, and control plans for new products.

• Coordinate engineering builds, monitor progress, and resolve technical issues during NPI phases.

• Support customer requirements, audits, and documentation for product qualification.

Process Engineering & Operations Support

• Provide technical support for assigned backend processes

• Troubleshoot process excursions, yield issues, and equipment-related problems.

• Analyze process data, SPC trends, and implement corrective and preventive actions (CAPA).

• Drive continuous improvement initiatives to enhance yield, quality, and cycle time.

• Support production in achieving output, quality, and cost targets.

• Work closely with Equipment, Quality, Production, and Supply Chain teams to ensure seamless operations.

• Interface with suppliers and vendors for material and equipment-related qualifications.

• Participate in design reviews and provide DFM (Design for Manufacturability) feedback.

• Maintain accurate documentation for process specifications, changes, and qualifications.

• Ensure compliance with internal standards, customer requirements, and industry regulations.

• Support audits (internal, customer, and certification audits).
  

Requirements

• Bachelor’s Degree in Electrical Engineering, Materials Science, Chemical Engineering, Mechanical Engineering, or related field.

• At least 5 years of experience in semiconductor manufacturing, preferably in backend/advanced packaging.

• Experience in NPI, process development, or high-mix manufacturing environment is an advantage.

• Familiarity with semiconductor processes such as lithography, wet, die prep, PnP, recon, and molding.

• Strong problem-solving skills with knowledge of root cause analysis tools (e.g., 8D, Fishbone, FMEA).

• Experience with SPC, DOE, and data analysis tools is preferred.

• Good communication and stakeholder management skills.

• Ability to work in a fast-paced, high-volume manufacturing environment.

• Knowledge of advanced packaging technologies (e.g., fan-out, wafer-level packaging).

• Hands-on experience with automation and MES systems.

• Six Sigma / Lean certification is a plus.