Process Technician (Dicing/Mask Alignment)

Key Responsibilities:

• Operate wafer dicing machines to cut wafers into individual dies according to specifications
• Perform mask alignment processes using mask aligner equipment for photolithography
• Load and unload wafers, masks, and related materials safely and accurately
• Set up machine parameters (alignment, cutting depth, speed, exposure settings, etc.)
• Conduct routine inspection of wafers and dies to ensure quality standards are met
• Monitor process performance and report any abnormalities or defects
• Perform basic troubleshooting and preventive maintenance on equipment
• Maintain cleanroom discipline and comply with EHS (Environment, Health & Safety) requirements
• Record production data, process parameters, and inspection results accurately
• Support engineers in process improvement and yield enhancement activities

Requirements:

• Diploma / NITEC in Engineering, Semiconductor Technology, or related field
• Minimum 1–3 years of experience in semiconductor manufacturing (dicing or photolithography preferred)
• Familiar with dicing saw and mask aligner equipment
• Ability to read and follow technical work instructions and drawings
• Basic understanding of cleanroom protocols and wafer handling
• Good attention to detail and quality awareness
• Able to work in a cleanroom environment and shift work (if required)