Senior/ Package Designer (Semiconductor industry)

Position Summary

The Senior Packaging Designer (BGA & Substrate & WLCSP) is responsible for product and tooling design.

Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.

Responsibilities

• With reference to internal design guidelines, work with the internal & external customer to:

- Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers.

- Generate test vehicle design and the related PCB design.

- Prepare design risk assessment report.

- Generate reticle and stencil design.

- Generate other schematics or drawing as requested.

• Review, maintenance and update the design guidelines.

• Manage the conversion of internal design into suppliers’ final design.

• Document all the drawing revisions and change records.

• Support audits

• Any other ad-hoc duties as assigned
  

Requirements

• At least a Bachelor’s Degree in Electrical/ Electronics Engineering, or similar discipline

• Preferably 5 - 10 years hand-on experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes. Other similar experience could be considered if relevant.

• Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability.

• Familiar with other design software like Linkcad, CAM350, AutoCAD, GDS editor and Gerber editors.

• Familiar with PCB test board design.

• Knowledge and understanding of wafer-level process and product reliability as well as other packaging assembly process would be advantageous.