Engineer, Staff (Ref: TD3088592)

Job Responsibilities:

Technology Development

• Lead development of new processes, modules, or integration flows from concept to qualification and manufacturing release.
• Define process requirements, success criteria, design‑of‑experiments (DOE), and characterization plans.
• Drive root‑cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets.
• Translate product requirements into process specifications and control strategies.

Technology Transfer & Ramp

• Co-own the technology transfer roadmap with project leader - from pilot line to high‑volume manufacturing. Adapts to shifting priorities and resources while ensuring deadlines are met.
• Supervise and provide technical guidance to onsite process transfer activities, including documentation (PFMEA, etc), training, process replication, and equipment matching.
• Work with each process cluster to establish critical process windows, statistical control limits, and ramp‑readiness criteria.
• Coordinate and report ramp performance tracking (yield, scrap, cycle time, tool capability) and drive closure of gaps.

Job Requirements:

• Bachelor’s or Master’s degree in Engineering (Materials, Chemical, Semiconductor, etc.).
• 5+ years of experience in process integration engineering, technology development, or a high-volume manufacturing fab.
• Broad exposure to wafer-level packaging technology and processes.
• Demonstrated success leading cross-disciplinary technology integration projects.
• Strong skills in DOE, SPC, data analytics, FMEA, and troubleshooting.
• Excellent communication, technical documentation, and stakeholder management skills.
• Resourceful with critical thinking in problem solving.
• Project and priority management skills.
• Experience in semiconductor, MEMS, packaging, or high‑volume manufacturing.
• Familiarity with yield engineering, reliability mechanisms, and failure analysis as well as use of statistical tools, DOE, PFCP/ PFMEA, etc.
• Experience with scale-up from R&D → Pilot → HVM.
• Knowledge of Lean, Six Sigma, or structured problem-solving (8D, DMAIC).
• Able to multi-task, set priorities and meet critical deadlines. Maintain open communication.