Senior /Lead Research Engineer (FOWLP/2.5D/3D package integration) (HI), IME
& standards: working knowledge of JEDEC/IPC/JESD (e.g., HTS, TC, HAST, BLR, EM), and failure analysis flows (X-ray, CSAM, FIB/SEM
Apply& standards: working knowledge of JEDEC/IPC/JESD (e.g., HTS, TC, HAST, BLR, EM), and failure analysis flows (X-ray, CSAM, FIB/SEM
ApplyJobs Job Description Job Title: Scientist, Photonics, Q.InC Requisition ID: 3261 Posting Start Date: 30/09/2026
Apply, with a strong interest in advancing semiconductor manufacturing technology. Comfortable working in a fast-paced R&D environment
Apply, immunoassays, and digital diagnostic technologies. Job Description We are seeking a Junior Electrical Engineer
ApplyJobs Job Description Job Title: Mechanical Engineer | Diagnostics Development Hub (DxD) | A*STAR Requisition ID: 2184 Posting Start Date: 24/09.../2026 Mechanical Engineer | Diagnostics Dev…
ApplyTitle: Scientist / Senior Scientist (X-ray & Computational Metrology), X-ray Section, Optics and Imaging System Group...-throughput, high-resolution inspection solutions. You will lead R&D…
Apply(AM), with a focus on composites, metallic and polymer systems. In a dynamic R&D environment, the engineer will support product... problem statements into practical product or system concep…
Applyas independently. Intern/working experience in semiconductor manufacturing/R&D will be considered a plus. Excellent communication
ApplyTell us what is wrong with this job. After review it may be removed.