Design Enablement & Tapeout Operations

Role and Responsibilities

• Supervise tapeout process from customer engagement to final jobview release.
• Resolve customer queries during their design process.
• Oversee DRC review, waiver & approval, GDS preparation & floorplanning for tapeout.
• Co-ordinate tapeout logistics with foundry TD, customer engineering.
• Oversee jobview and MEBES approval / release for tapeout.
• Verify component performance against design target.
• Si photonics design to enhance PDK elements for Design for Manufacturing (DFM).
• Support PDK development with Designer and Electronics Photonics Design Automation (EPDA) vendors like Ansys-Lumerical, Siemens-Mentor, Cadence or Luceda.
• Maintain & upgrade PDK to enhance competitiveness.
• Support CompoundTek Technology roadmap with design services

Qualifications and Education Requirements

• PhD/Master/Degree in Microelectronics/Electrical/Electronic Engineering/Physics/Material Science.
• At least 5 years relevant experience in Design Enablement and / or Tapeout Operations working with foundry customers.
• Si photonics knowledge preferred but not mandatory.
• Good interpersonal, effective presentation and communication skills.

Additional Attributes

• Exhibit Initiative, ownership, accountability and a team player.
• Able to perform under a fast paced and challenging environment.
• Demonstrate strong problem-solving skills.