Equipment Senior / Engineer (semiconductor industry)

Equipment - CoW (Chip-on-wafer)
Equipment - Bumping

Responsibilities:

• To manage, operate, and maintain all core process equipment and associated utility interfaces to ensure maximum tool availability and operational stability.
• To execute routine preventive maintenance (PM), drive rapid breakdown troubleshooting, and lead tool qualification/hook-up for line equipment
• Tool Hook-up, Setup & New Equipment Qualification
• Equipment OEE Optimization & Spare Parts Management
• Equipment Vendor Technical Management, Tool Specification Review & Escalation Handling

Requirements:

• Bachelor’s degree in Mechanical Engineering, Electrical/Electronic Engineering, Material Science, or related engineering disciplines (or Diploma with equivalent extensive industry experience)
• R&D or mass production experience of at least eight years in semiconductor equipment engineering
• Proven track record in equipment setup, utility hook-up (vacuum, CDA, ultra-pure water, specialty gases), and tool qualification for mass production/R&D
• Strong capability in vendor management, negotiating tool specifications, and driving vendor technical support for new equipment qualification
• Excellent problem-solving skills in equipment failure analysis (FA), OEE improvement, and cross-functional collaboration with process and utility teams