R&D Senior / Engineers

R&D - Lithography
R&D - Underfill / Cure
R&D - Plating, PR Strip, Wet Etch
R&D - CA & TCB

Responsibilities:

• To design, qualify, and optimize advanced processes that meet strict design rules and high-density packaging requirements, ensuring stable, cost-effective, and scalable technology delivery according to the technology roadmap.
• Lead assigned projects.
• Yield Improvement & Yield Failure Analysis (FA)
• Technology Qualification & Transfer
• Equipment & Material Evaluation

Requirements:

• Bachelor’s degree or higher in engineering disciplines such as Materials Science, Mechanical Engineering, Chemical Engineering, Electronics, or Advanced Materials
• R&D or mass production experience of at least three years in processes
• Proficiency in data analysis tools (e.g., JMP, MATLAB, Excel)
• Strong analytical and problem-solving skills
• Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting
• Experience in customer-driven development programs, customer qualification, and technical issue resolution for semiconductor packaging solutions.