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Senior/Staff Engineer, Thermal Mechanical Simulation (13554)

8 000 – 10 000 $

Location

SERANGOON NORTH AVENUE 5

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About this job

The Team

The Optical Product Packaging & Design team, based in Edinburgh and Singapore, is part of ST’s wider Imaging & Custom subgroup. The team designs and develops precision opto-mechanical assemblies incorporating ST silicon sensors to deliver advanced optical and photonic products.

The Role

As a Thermal-Mechanical Simulation Engineer, you will work closely with the R&D project team to develop products that meet performance, manufacturability, and cost objectives. Using advanced simulation tools, you will perform finite element analysis (FEA), computational fluid dynamics (CFD), and multiphysics studies to identify potential issues early in the development process and to recommend design improvements that enhance product performance and robustness.

You will also use analysis tools to support failure investigation and root cause analysis. In this role, you will collaborate with package design engineers, optical engineers, substrate designers, and core team members to ensure that proposed improvements are properly verified and implemented.

This position requires regular interaction with stakeholders across multiple geographic locations. The successful candidate must be comfortable working across different time zones and travelling at short notice where required.

Key Skills and Experience

Essential skills

  • Finite element analysis
  • Thermal-mechanical analysis
  • Computational fluid dynamics
  • Multiphysics analysis
  • Material characterization
  • Python scripting
  • Strong written and verbal communication skills
  • Ability to work effectively in a customer-facing environment

Knowledge and experience

  • Bachelor’s, Master’s, or PhD in Mechanical Engineering, with relevant undergraduate modules
  • Strong knowledge of material science
  • Good understanding of solid mechanics, including static and dynamic behaviour
  • Sound knowledge of thermal engineering and heat transfer
  • Minimum 5 years of relevant experience
  • Experience in mold flow analysis
  • Experience in collaborative design environments
  • Familiarity with FMEA
  • CAD proficiency in SolidWorks
  • Understanding of product design processes
  • Strong documentation and presentation skills

Market insight

79% above median
5 030 $

Based on 1 254 offers with salary for Jobs on-site in Sengkang

Full salary breakdown

STMICROELECTRONICS ASIA PACIFIC PTE LTD Sengkang ·

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6 500 – 8 500 $
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5 500 – 7 000 $
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Frequently asked questions

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The employer lists 8 000 – 10 000 $ for this role at STMICROELECTRONICS ASIA PACIFIC PTE LTD in Sengkang. For comparison, the local market median is about 5 030 $ based on 1 254 similar offers.

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