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Equipment Engineer – CoW

4 500 – 6 500 $
Full time6+ yearsOn-siteSingapore

Location

YISHUN INDUSTRIAL PARK A

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About this job

About the role

To oversee, maintain, and optimize all core Chip-on-Wafer (CoW) line equipment and associated utility interfaces to ensure maximum tool availability, process stability, and high operational yield. To lead routine/advanced preventive maintenance (PM), resolve critical equipment breakdowns, and drive tool qualification/hook-up for CoW line equipment, leveraging 10+ years of deep technical expertise in advanced 2.5D/3D packaging equipment.

Key responsibilities

  • Full-line CoW Equipment & Utility Maintenance Management (e.g., TCB, Flip Chip Bonder, CMP, Dicing, Cleansing)

  • Advanced Troubleshooting, Root-Cause Failure Analysis & Preventive Maintenance (PM) Optimization

  • New Tool Hook-up, Setup, Buy-off & High-Precision Calibration (Sub-micron Alignment)

  • Tool OEE (Overall Equipment Effectiveness) Optimization, Unplanned Downtime Reduction & Spare Parts Inventory Control

  • Collaboration with Process & R&D Engineers to Resolve Yield Issues and Ensure Line Stability

  • Equipment Vendor Technical Management, Tool Specification Review & Escalation Handling

About you

  • Bachelor's degree in Mechanical Engineering, Electrical/Electronic Engineering, Material Science, or related engineering disciplines (or Diploma with equivalent extensive industry experience)

  • Minimum 8 to 10 years of hands-on equipment engineering experience in semiconductor packaging, specifically in CoW, 2.5D/3D stacking, or Advanced Flip-Chip lines

  • Deep technical expertise in high-precision bonding equipment (TCB, FCB), dicing, CMP, or thin-wafer handling systems

  • Proven track record in equipment setup, utility hook-up (vacuum, CDA, ultra-pure water, specialty gases), and tool qualification for mass production/R&D

  • Strong analytical and problem-solving skills for complex equipment failure modes (FA), thermal-mechanical behavior, and yield enhancement

  • Excellent vendor management capability to direct equipment suppliers for technical modifications, tool upgrades, and escalation resolution

  • Strong communication skills in English for technical reporting, cross-functional collaboration, and vendor negotiations


Market insight

15% above median
4 800 $

Based on 75 102 offers with salary for this country

Full salary breakdown

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Frequently asked questions

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The employer lists 4 500 – 6 500 $ for this role at STATS CHIPPAC MANAGEMENT PTE. LTD. in Singapore. For comparison, the local market median is about 4 800 $ based on 75 102 similar offers.

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