Senior Research Engineer, Process Modules

We are seeking a Lead Research Engineer to drive the development of advanced wafer pre-assembly processes, including backgrinding, wafer thinning, edge trim, dicing, and singulation technologies for next-generation semiconductor and advanced packaging applications.

Key Responsibilities:

Technical Leadership & Project Management
• Lead and mentor a team of engineers in developing advanced wafer pre-assembly technologies.
• Define technical roadmaps and align process development with industry and customer requirements.
• Initiate, plan, and execute R&D projects, including collaborations with equipment and material suppliers.
• Drive process transfer from development to pilot manufacturing environments.

Process Development
• Develop and optimize wafer backgrinding, stress relief, edge trim, dicing, and singulation processes.
• Evaluate and qualify new grinding wheels, dicing blades, laser dicing technologies, tapes, and consumables.
• Optimize process performance for wafer thickness control, TTV, edge quality, chipping, wafer warpage, and yield.
• Address integration challenges associated with ultra-thin wafers, compound semiconductors, MEMS, photonics, and advanced packaging applications.

Characterization & Failure Analysis
• Conduct process characterization and performance evaluation using metrology and inspection tools.
• Investigate wafer breakage, micro-cracks, edge chipping, particle generation, and singulation-related defects.
• Analyze process and yield data to identify root causes and implement corrective actions.
• Work closely with integration, reliability, and manufacturing teams to resolve process issues.

Innovation & Collaboration
• Generate technical reports, patents, publications, and intellectual property.
• Collaborate with equipment vendors, material suppliers, and research partners to develop next-generation solutions.
• Support business development activities by engaging customers and translating industry challenges into R&D programs.
• Mentor junior engineers and contribute to building organizational capabilities.

Qualifications:
• Bachelor's Degree or Master Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, Physics, or a related discipline.
• Minimum 8-10 years of experience in semiconductor process development.
• Hands-on experience in backgrinding, wafer thinning, stress relief, edge trim, dicing, and singulation processes.
• Strong understanding of wafer handling, defect control, process integration, and advanced packaging technologies.
• Experience with failure analysis, DOE, statistical process control, and semiconductor metrology.
• Proven track record in leading technical projects and working with cross-functional teams.

Apply now

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.