Engineer – Wafer Bumping Equipment

Engineer – Wafer Bumping Equipment (PVD / Descum / Wet)

Responsibilities

• Equipment Maintenance & Operations: Lead equipment startup, installation, and maintenance for PVD, Descum, and Wet systems. Plan and execute Corrective Maintenance (CM) and Preventive Maintenance (PM) to ensure high reliability.

• Technical Troubleshooting & Optimization: Conduct in-depth technical and failure mode analyses. Drive continuous improvement, upgrades, and capacity optimization projects to maximize Overall Equipment Effectiveness (OEE).

• Smart Factory & Facility Integration: Set up and monitor Electrostatic Discharge (ESD) systems. Support and maintain Smart Factory automation systems, including Autonomous Mobile Robots (AMR) and Chemical Delivery Systems (CDS).

• Vendor & Spare Parts Management: Track and order spare parts using internal systems. Negotiate with external suppliers regarding service support, parts inquiries, quotations, and inventory levels.

• Documentation & Compliance: Conduct risk assessments for existing and new equipment. Generate One-Point Lessons (OPLs) and operational procedures to support Quality Management System (QMS) compliance.

• Team Leadership & Mentorship: Lead and direct the equipment support team, providing training and technical guidance to junior personnel.

Requirements

• Education: Bachelor’s degree in Engineering (preferably Mechanical, Electrical, or Electronics).

• Experience: Minimum 3 years of relevant equipment engineering experience, preferably in the semiconductor industry (Wafer Bumping / PVD / Descum / Wet equipment).

• Technical Familiarity: Hands-on experience with equipment reliability, PM/CM execution, ESD controls, and automated factory systems (AMR/CDS).

• Core Competencies: Strong analytical, troubleshooting, communication, and vendor negotiation capabilities.
  
  We regret that only shortlisted candidates will be notified.

  CopperCo Talent Services Pte Ltd | EA Licence No: 20C0333 | EA Personnel Reg. No. R26163306