Position Summary The Senior Packaging Designer (BGA & Substrate & WLCSP) is responsible for product and tooling design. Candidates with wafer bumping, WLCSP, BGA or fanout packaging experie…
Position Summary The Electrical Simulation Engineer is responsible for product package electrical simulation. Candidates with semiconductor packaging experience are encouraged to apply for…
Position Summary The Technical Program Manager is responsible for overall management of customers’ technical projects and related matters. Candidates with wafer bumping, WLCSP, or fanout pa…
Position Summary The Technical Program Specialist is responsible for overall management of customers’ technical projects and related matters. Candidates with wafer bumping, WLCSP, or fanout…
Position Summary The Account Specialist is responsible for customer order planning including management, logistics arrangement and other ad-hoc services for customers. This is not a sales p…
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