Principal Process Engineer

Work Summary:

We are seeking highly skilled and experienced engineering talents to join our Singapore R&D team as technical

leaders for our advanced photonics packaging design and process development. The ideal candidate should have

a deep understanding of photonics and semiconductor packaging technologies, extensive hands-on experiences in

developing and implementing advanced packaging solutions. This role involves leading cross functional team in

complex projects, mentoring junior team members, identifying and integrating emerging technologies and

methodologies into product design and packaging processes, driving innovations in photonics packaging and new

product development.

Key Responsibilities:

• Lead the design, development, and optimization of advanced photonics packaging solutions and

processes for fiber optic interconnect products, including pluggable optical transceivers, advanced

packaged optical interconnects, optical switching products etc.

• Work closely with cross functional team in product and technology development projects from concept

to production, coordinate internal resources, manage corresponding suppliers and partners to ensure

critical deliverables in schedule, performance, quality and manufacturability are met.

• Define test strategy, DFM matrix and requirements for new products and process development, manage

prototypes and test vehicles builds. Analyze test data to identify and resolve design and process issues.

• Develop and optimize packaging processes, including flip chip and wafer bonding, die attach, wire

bonding, and fiber alignment. Implement process control measures and continuous improvement

initiatives to enhance manufacturing yield and product quality. Collaborate with manufacturing teams to

scale processes for high-volume production.

• Develop, lead and grow a highly competent engineering team, mentor and provide technical guidance to

junior engineers and cross-functional teams.

• Keep abreast of the latest advancements in photonics and packaging technologies through literature

review, conferences, research and industry networking and collaborations. Conduct feasibility studies and

research on new materials, processes, and packaging techniques. Contribute to patent filings, publications,

and presentations to establish the company as a leader in photonics packaging.

Qualification:

• Bachelor or above in Electrical Engineering, Mechanical Engineering, Physics, Materials Science, or a

related field.

• Minimum 10 years of experience in advanced packaging design and process development, with a proven

track record of leading and delivering successful projects.

• Extensive knowledge in optical communication, high speed transceivers, integrated photonic devices,

MEMS, precision flip chip bonding, 2.5D/3D silicon photonics packaging and processes, Co-packaged

optics etc.

• Proficiency in CAD software for packaging design (Solidworks, Zemax etc).

• Knowledge of thermal management, stress analysis, and reliability testing in photonics packaging.

• Excellent problem-solving and analytical skills.

• Strong leadership, project management, and organizational skills.

• Effective communication and interpersonal skills, bilingual with both English and Chinese, with the

ability to work with diverse teams and stakeholders.