Failure Analysis Engineer (Semiconductor/Automotive)
About this job
about the company
Our client is a global technology company focused in the manufacturing and supplying of automotive components. They provide solutions to the global automotive and commercial vehicle market and now have opportunities for an Engineer/Senior Engineer, Failure Analysis to join their team during an exciting time in their development.
about the job
- Responsible to lead and perform analyses of automotive electronics products.
- Develop strategies and implement methods in the Lab for Failure Analyses and Tear down
- Synergize FA activities by working with local and global teams as needed
- Lead FA technicians on Elemental & Metallurgical Analyses, Non-Destructive Analyses (CT Scan, SAM, Laser Confocal Microscope etc.), Thermal Analyses (DSE, TGA), Physical & Mechanical Analyses (Hardness, Texture, Contact Angle, CMM, Smart scope, Tensile tester etc.)
- Improve FA lab capabilities in 4M aspects
- Participate and demonstrate Failure Analysis capabilities to customers
job requirement
- Master's Degree in Electronics/Mechanical/Physics/Material Science or PhD in Material Science
- Minimum 5 to 7 years’ experience in a semiconductor or automotive electronics manufacturing environment is preferred.
- Experience in application of Failure analysis tools / methodologies
- Experience in handling Failure Analysis Lab.
If you are interested in the position, kindly send your CVs to [email protected].
Please include your availability, expected salary and reason for leaving your current job.
We regret that only shortlisted candidates will be contacted.
EA: 94C3609 / Reg: R25154228
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The employer lists 4 000 – 5 000 $ for this role at RANDSTAD PTE. LIMITED in Singapore. For comparison, the local market median is about 4 800 $ based on 75 102 similar offers.
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