Process Engineering Trainee (Physical Vapor Deposition - PVD) - GRIT Traineeship

The trainee will undergo structured on-the-job training within the Physical Vapor Deposition (PVD) Process Engineering team in a 300mm semiconductor wafer fabrication facility. The programme aims to equip the trainee with fundamental knowledge and practical skills in semiconductor manufacturing, process monitoring, statistical process control (SPC), data analysis, problem-solving methodologies, and continuous improvement. Under the guidance of experienced engineers, the trainee will support process monitoring activities and participate in improvement projects to enhance manufacturing quality, yield, and productivity.

1. Learn semiconductor manufacturing fundamentals and the role of PVD processes in wafer fabrication.

2. Support monitoring of daily process performance and key process indicators.

3. Assist in process data collection, analysis, and reporting using manufacturing systems and SPC tools.

4. Participate in process troubleshooting and root cause investigations under engineer supervision.

5. Support process improvement initiatives to enhance process stability, quality, and productivity.

6. Work with cross-functional teams to understand manufacturing operations, quality requirements, and engineering practices.

7. Complete a structured improvement project and present findings, recommendations, and learning outcomes at the end of the traineeship.

Requirements
'- Fundamentals of semiconductor manufacturing and wafer fabrication.

- Basic knowledge of Physical Vapor Deposition (PVD) processes.

- Statistical Process Control (SPC) and Process monitoring techniques.

- Engineering data analysis and interpretation.

- Structured problem-solving and root cause analysis methodologies.

- Process improvement and continuous improvement principles.

- Technical communication, teamwork, and presentation skills.

- Workplace safety and quality management awareness within a semiconductor manufacturing environment.