Silicon Product Integration Engineer

Role Overview

We are seeking an experienced Product Engineer to lead silicon product engineering, foundry engagement, and NPI execution for next-generation MEMS programs. The role serves as the technical bridge between HP, foundry partners, design teams, manufacturing organizations, and worldwide program teams to ensure successful technology development, qualification, and high-volume manufacturing readiness.

The successful candidate will combine deep semiconductor foundry experience with strong program leadership skills to drive product execution from technology development through qualification and production launch.

Key Responsibilities

Product Engineering Leadership

• Own silicon product engineering activities across development, qualification, ramp, and sustaining phases.
• Drive structural cost saving initiative in wafer Foundry and advanced packaging factories.
• Lead NPI silicon builds and ensure timely execution of wafer, and advanced packaging factories deliverables.
• Partner with design, architecture, reliability, systems, and manufacturing teams to close technical issues.
• Drive issue resolution and technical solution for the process marginality and escalation.

Foundry and Technology Development

• Serve as the primary technical interface with internal/external foundries and technology partners.
• Drive technical reviews, process optimization, design enablement, and qualification activities.
• Lead root-cause investigations and corrective actions related to yield, reliability, and manufacturability.
• Assess technology options and recommend development strategies for future products.

Program and NPI Leadership

• Program Management Leadership cross-functional execution for strategic MEMS programs.
• Develop and manage technical schedules, milestones, dependencies, and risk mitigation plans.
• Coordinate worldwide teams across design, process, integration, manufacturing, supply chain, and program management.
• Drive technical decision-making through product design cycles and qualification checkpoints.

Required Qualifications

• Bachelor's, Master's, or PhD in:
• Electrical Engineering Mechanical Engineering Materials Science Semiconductor Engineering Physics Related technical disciplines
• 8+ years semiconductor industry experience.
• Experience working directly with semiconductor foundries.
• Strong background in:
• Product Engineering Yield Engineering Process Integration Device Engineering Failure Analysis Semiconductor Manufacturing
• Experience leading cross-functional development programs.
• Demonstrated ability to drive technical decisions across multiple organizations.
• Strong communication and stakeholder management skills.

Preferred Experience

• MEMS development experience.
• NPI and high-volume manufacturing launch experience.
• Experience working with internal/external wafer foundry manufacturing partners.
• Program management experience for complex technical programs.

Success Profile

The ideal candidate can:

• Translate complex technical challenges into executable plans.
• Effectively influence across design, manufacturing, and program organizations.
• Operate comfortably with both deep technical details and executive-level discussions.
• Build strong partnerships with foundries and external technology providers.
• Balance technical rigor, schedule execution, and business priorities.
• Develop the next generation of engineering capability within HP.