MNC Semiconductor | Equipment Engineer (Wire Bond)

Our client is a leading global semiconductor manufacturing company specializing in advanced semiconductor technologies. They are expanding their operations and are looking for motivated individuals to join their growing team.

Position: Associate Engineer – Wire Bond Equipment
Location: North Region
Working Hours: 12-hour rotating shift (Day & Night Shift)
Employment Type: Permanent Role

Job Responsibilities

• Perform equipment setup, qualification, and conversion for Wire Bond machines.

• Troubleshoot and repair equipment-related issues to minimize production downtime.

• Conduct preventive and corrective maintenance to ensure equipment reliability.

• Monitor equipment performance and implement improvement actions.

• Support production during machine breakdowns and urgent technical issues.

• Perform root cause analysis, implement corrective actions, and maintain equipment and spare parts records.

Job Requirements

• Minimum Diploma in Electrical, Electronics, Mechanical, Mechatronics Engineering, or related discipline.

• Minimum 2 years of hands-on experience in Wire Bond equipment maintenance and troubleshooting.

• Experience with KNS Maxum, iConn, or Rapid Bonder machines is preferred.

• Strong equipment troubleshooting, maintenance, and problem-solving skills.

• Knowledge of semiconductor backend assembly processes is an advantage.

• Willing to work 12-hour rotating shifts, including day and night shifts.