Associate Equipment Engineer (Mold Process) – MNC Semiconductor
About this job
Our client is a leading global semiconductor manufacturing company specializing in advanced semiconductor technologies. They are expanding their operations and are looking for motivated individuals to join their growing team.
Position: Associate Equipment Engineer – Mold Process
Location: North Region
Working Hours: 12-hour rotating shift (Day & Night Shift)
Employment Type: Permanent Role
Job Responsibilities
Provide equipment maintenance and technical support for Mold production operations.
Troubleshoot, repair, and recover Mold equipment, particularly Daiichi machines, to minimize production downtime.
Perform preventive maintenance, equipment inspections, and calibration according to established schedules.
Support machine setup, equipment qualification, and release for production.
Analyze equipment failures, perform root cause analysis, and implement corrective actions.
Monitor equipment performance and support continuous improvement activities to enhance OEE, MTBF, MTTR, and equipment reliability.
Maintain equipment maintenance records and collaborate with Production and Process Engineering teams.
Job Requirements
Minimum Diploma in Electrical, Mechanical Engineering, or related discipline.
Minimum 2 years of hands-on equipment maintenance and troubleshooting experience.
Experience with Mold equipment, preferably Daiichi or Towa machines.
Strong troubleshooting skills in electrical, mechanical, pneumatic, and hydraulic systems.
Able to independently perform machine troubleshooting, repair, recovery, and setup.
Knowledge of tooling design and maintenance is an advantage.
Good problem-solving and teamwork skills, with the ability to work independently.
Willing to work 12-hour rotating shifts, including day and night shifts.
Market insight
38% below the medianExplore related jobs
Similar jobs
See all similar jobsValidation Test Engineer (Fresh Graduate Welcome/MNC Semiconductor)
TA Specialist (Recruitment Processes & Compliance) - US MNC
Research Engineer / Senior Engineer – Advanced Packaging & Process Integration
Workforce Development Specialist – SAP / S4HANA (MNC Semiconductor)
MNC Semiconductor | Equipment Engineer (Singulation Process)
MNC Semiconductor | Equipment Engineer (Wire Bond)
Frequently asked questions
What salary can I expect?
The employer lists $2,800 – $4,000 for this role at WANCO MANPOWER PTE LTD in Singapore. For comparison, the local market median is about 5 479 $ based on 23 086 similar offers.
How do I apply for this job?
Open the original source page and contact the employer there. Finder never charges job seekers.
Are these jobs up to date?
Yes. Finder regularly refreshes vacancies from public sources and removes closed offers.
Where can I see employment type and work format?
Key conditions are shown above the description. You can also open related listings for WANCO MANPOWER PTE LTD and Singapore.