Lab Technician (Semiconductor Substrate)

Responsibilities

• Prepare PCB and semiconductor package samples through cross-sectioning, mounting, grinding, and polishing.
• Perform optical microscopy inspections and Scanning Electron Microscopy (SEM) analysis for failure analysis and material characterization.
• Analyze cross-sectional images to evaluate layer thickness, plating quality, via structures, solder joints, and material interfaces.
• Operate and maintain laboratory equipment, including cross-section preparation tools, optical microscopes, and SEM systems.
• Document inspection results, observations, and analysis findings accurately.
• Prepare technical reports detailing inspection results and material characterization findings.
• Communicate analysis results and technical findings to engineers and project stakeholders.

Requirements

• Minimum Diploma in Engineering, Materials Science, Electronics, or a related field.
• 2 years or more of hands-on experience in semiconductor package sample preparation, mounting, grinding, polishing, and cross-sectioning.
• Experience operating optical microscopes and SEM equipment.
• Experience in image analysis, metrology, and technical reporting software.
• Ability to identify and document defects, including voids, cracks, contamination, and delamination.
• Familiarity with semiconductor packaging and PCB manufacturing processes.
• Strong attention to detail, analytical thinking, and technical documentation skills.
• Ability to work independently and collaborate effectively with engineering teams.

Future Skill Development Opportunities (On-the-Job Training)

• Learn AI-assisted tools for report generation and test result documentation.
• Assist in managing largedatasets and performing trend analysis for process monitoring.
• Collaborate with engineers on machine vision and AI-based defect detection projects.

We invite qualified candidates to apply online or email your resume to [email protected]

EA License No: 13C6655
EA Reg No: R1109557 Rose