Wire Bond Process Engineer (Semiconductor Manufacturing / EMS)

Responsibilities

• Optimize gold, silver, and copper wire bonding processes to ensure stability, quality, and adherence to customer specifications.
• Conduct failure analysis to identify root causes and implement preventive measures for wire bonding defects.
• Coordinate New Product Introduction (NPI) and Qualification (NPQ) timelines, qualifying new products, materials, and machinery.
• Collaborate on R&D for new tape and material development, including supplier sourcing and qualification with purchasing teams.
• Benchmark new material technologies and advanced assembly equipment in the market.
• Maintain, troubleshoot, and perform minor repairs on assembly and testing equipment.
• Develop and update Standard Operating Procedures (SOPs) while actively participating in internal, customer, and external audits.
• Train operational personnel on new process rollouts and ensure compliance with company quality and EHS standards.

Requirements

• Diploma or Degree in Engineering, preferably in Electronics, Materials Science, or a related discipline.
• Minimum 3 years of manufacturing experience, preferably within a semiconductor assembly and test environment.
• Practical experience operating ESEC, ASM, or KNS wire bonders using gold, silver, and copper wires.
• Strong knowledge of IC assembly processes (die attach, wire bonding, encapsulation, testing) and equipment maintenance.
• Solid understanding of material science related to bonding wires, encapsulant epoxy, and structural substrates.
• Proficiency in quality and engineering methodologies, including FMEA, SPC, OCAP, DOE, ISO 9001/14001, and JEDEC.
• Strong analytical, troubleshooting, communication, and interpersonal skills.
• Ability to multitask and work effectively both independently and collaboratively in a fast-paced environment.

Interested candidates who wish to apply for the advertised position, please click on the APPLY button below to send in your resume or send to [email protected]

EA License No: 13C6305

Reg. No.: R1985234 (GOH HOOI MING)

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