Job is active
Process Engineer (Wire Bond)
4 500 – 5 500 $
GMP TECHNOLOGIES (S) PTE LTDSingapore
About this job
Responsibilities
- Develop new and improve existing gold, silver, and copper wire bonding process capability, stability, and quality
- Ensure wire bonding process meets customer's specifications and requirements
- Conduct failure analysis to identity root cause of wire bonding failures and find solutions to prevent future failure
- Co-ordinate NPI and NPQ activities to meet given timeline
- Qualify new product, material, device, and machinery
- Participate in new tape development, and new material development activities
- Perform supplier sourcing and qualification activities jointly with purchasing and engineering team
- Benchmark new materials and new equipment technology in the market
- Train co-workers on new process implementation and new machinery operations
- Maintain, troubleshoot, and perform minor repair of assembly and test machinery
- Develop new and update existing Standard Operating Procedures
- Participate in internal audits, customers' audits and external audits
- Comply with all quality, environmental, health, safety, and security policies and procedures of the Company
Requirements
- Degree or Diploma in Material Science / Electronics Engineering
- Minimum 2-3 years working experience in a manufacturing environment (preferably in Semiconductor assembly and test environment / OSAT)
- Experience in operating ESEC, ASM, KNS wire bonders using Gold, Silver, and Copper wires
- Knowledgeable in the material science of bonding wires (gold, silver, copper), encapsulant epoxy, and structural substrates.
- Module knowledge in IC assembly processes such as die attach, wire bond, encapsulation, and testing
- Good team player, able to work independently, resourceful, willing to learn new skills, and has initiatives
- Knowledge in FMEA, SPC, OCAP, DOE, ISO9001:2000, ISO14001:2004, QEMS, CQM, JEDEC
- Good in problem solving, excellent interpersonal and communication skill
GMP Technologies (S) Pte Ltd | EA License 11C3793 | EA Personnel: Novita Widjaja | Registration No: R22105960
Market insight
11% below median5 648 $
5 648 $5 648 $
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The employer lists 4 500 – 5 500 $ for this role at GMP TECHNOLOGIES (S) PTE LTD in Singapore. For comparison, the local market median is about 5 648 $ based on 27 416 similar offers.
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