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Process Engineer (Wire Bond)

4 500 – 5 500 $

About this job

Responsibilities

  • Develop new and improve existing gold, silver, and copper wire bonding process capability, stability, and quality
  • Ensure wire bonding process meets customer's specifications and requirements
  • Conduct failure analysis to identity root cause of wire bonding failures and find solutions to prevent future failure
  • Co-ordinate NPI and NPQ activities to meet given timeline
  • Qualify new product, material, device, and machinery
  • Participate in new tape development, and new material development activities
  • Perform supplier sourcing and qualification activities jointly with purchasing and engineering team
  • Benchmark new materials and new equipment technology in the market
  • Train co-workers on new process implementation and new machinery operations
  • Maintain, troubleshoot, and perform minor repair of assembly and test machinery
  • Develop new and update existing Standard Operating Procedures
  • Participate in internal audits, customers' audits and external audits
  • Comply with all quality, environmental, health, safety, and security policies and procedures of the Company

Requirements

  • Degree or Diploma in Material Science / Electronics Engineering
  • Minimum 2-3 years working experience in a manufacturing environment (preferably in Semiconductor assembly and test environment / OSAT)
  • Experience in operating ESEC, ASM, KNS wire bonders using Gold, Silver, and Copper wires
  • Knowledgeable in the material science of bonding wires (gold, silver, copper), encapsulant epoxy, and structural substrates.
  • Module knowledge in IC assembly processes such as die attach, wire bond, encapsulation, and testing
  • Good team player, able to work independently, resourceful, willing to learn new skills, and has initiatives
  • Knowledge in FMEA, SPC, OCAP, DOE, ISO9001:2000, ISO14001:2004, QEMS, CQM, JEDEC
  • Good in problem solving, excellent interpersonal and communication skill

GMP Technologies (S) Pte Ltd | EA License 11C3793 | EA Personnel: Novita Widjaja | Registration No: R22105960

Market insight

11% below median
5 648 $

Based on 27 416 offers with salary for Jobs on-site in Singapore

Full salary breakdown

GMP TECHNOLOGIES (S) PTE LTD Singapore ·

Quantity Surveyor

4 000 – 5 500 $
Full time1–3 yearsOn-siteSingapore
GMP TECHNOLOGIES (S) PTE LTD Singapore ·

Senior Quantity Surveyor

5 000 – 7 000 $
Full time6+ yearsOn-siteSingapore

Frequently asked questions

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The employer lists 4 500 – 5 500 $ for this role at GMP TECHNOLOGIES (S) PTE LTD in Singapore. For comparison, the local market median is about 5 648 $ based on 27 416 similar offers.

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