Software Engineer (Semicon, MNC)

Key Responsibilities

• Design and develop machine control systems, software, and hardware for die and wire bonding equipment.
• Perform software-hardware integration, testing, qualification, and documentation.
• Analyze customer requirements and develop suitable solutions and modifications.
• Provide technical support and troubleshooting for customers.
• Define software development processes and engineering standards.
• Plan and manage technical projects to meet quality and timeline requirements.
• Develop engineering documentation, SOPs, and guidelines.

Job Requirements

• Degree in Electronics, Electrical, or Mechatronics Engineering (Second Upper or above).
• Strong in software programming and electrical/electronics design for die and wire bonding machines.
• Proficient in Visual C++, C#, and VB.NET.
• Strong semiconductor process knowledge.
• Excellent technical leadership, analytical, and problem-solving skills.
• Self-motivated, innovative, and able to work independently and in teams.
• Willing to learn and take on new challenges.

For interested applicants, kindly send your resume in Word/PDF format to include the following in your resume including:

1. Current Salary

2. Expected Salary

3. Availability

4. Reason for leaving

Thank you for your application and we regret that only shortlisted applicants will be notified

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